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298D
Vishay Sprague
Solid Tantalum Chip Capacitors MICROTANTM Leadframeless Molded
FEATURES
* * * 0805, 0603 and 0402 footprint Lead (Pb)-free L-shaped terminations 8 mm tape and reel packaging available per EIA-481-1 and reeling per IEC 286-3 7" [178 mm] standard
PERFORMANCE CHARACTERISTICS
Operating Temperature: - 55 C to + 85 C (to + 125 C voltage derating) Capacitance Range: 0.68 F to 220 F Capacitance Tolerance: 20 % standard Voltage Range: 2.5 WVDC to 50 WVDC
ORDERING INFORMATION
298D MODEL 106 CAPACITANCE X0 CAPACITANCE TOLERANCE X0 = 20 % X9 = 10 % 010 DC VOLTAGE RATING AT + 85 C This is expressed in volts. To complete the three-digit block, zeros precede the voltage rating. A decimal point is indicated by an "R" (6R3 = 6.3 V). M CASE CODE 2 TERMINATION T REEL SIZE AND PACKAGING
This is expressed in picofarads. The first two digits are the significant figures. The third is the number of zeros to follow.
See Ratings 2 = 100 % Tin T = Tape and Reel and Case 4 = Gold Plated 7" [178 mm] Reel Codes Table
Note: Preferred tolerance and reel size are in bold. We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. Voltage substitutions will be marked with the higher voltage rating.
DIMENSIONS in inches [millimeters]
Anode Polarity Bar Anode Termination Cathode Termination
C
W
H
P1
P2
P1
L
CASE K M P
L 0.039 + 0.008 [1.0 + 0.2] 0.063 0.004 [1.60 0.1] 0.094 0.004 [2.4 0.1]
W 0.02 + 0.008 [0.5 + 0.2] 0.033 0.004 [0.85 0.1] 0.057 0.004 [1.45 0.1]
H 0.024 max. 0.6 max. 0.031 0.004 [0.80 0.1] 0.043 0.004 [1.10 0.1]
P1 0.01 0.004 [0.25 0.1] 0.020 0.004 [0.50 0.1] 0.020 0.004 [0.50 0.1]
P2 (REF.) 0.02 [0.5] 0.024 [0.60] 0.057 [1.40]
C 0.015 0.004 [0.38 0.1] 0.024 0.004 [0.60 0.1] 0.035 0.004 [0.90 0.1]
* Please see document "Vishay Green and Halogen-Free Definitions (5-2008)" http://www.vishay.com/doc?99902 www.vishay.com 38 For technical questions, contact: tantalum@vishay.com Document Number: 40065 Revision: 01-Sep-08
298D
Solid Tantalum Chip Capacitors MICROTANTM Leadframeless Molded
RATINGS AND CASE CODES
F 2.5 V 4V 6.3 V 0.68 1.0 K 2.2 K/M 3.3 4.7 K K*/M 6.8 10 K/M K*/M 15 K* 22 M M 33 M M 47 M M P* 100 P* P 220 P P Note: * Preliminary values, contact factory for availability. 10 V K K/M M M M M* P* P 16 V K/M M M 25 V M 35 V M* 50 V P*
Vishay Sprague
P
MARKING
M-case Polarity Bar Voltage Code
A
K-case
V 4 6.3 10 16 20 25 35 50
M-CASE CODE G J A C D E V T
P-CASE CAP, F CODE 0.68 w 1 A 2.2 J 3.3 N 4.7 S 6.8 W 10 a 15 e 22 l 33 n 47 s 68 w 100 A 150 E 220 J
P-case Polarity Bar
Capacitance Voltage Code Code
GJ
STANDARD RATINGS
CAPACITANCE (F) CASE CODE MAX. RIPPLE MAX. ESR MAX. DC MAX. DF AT + 25 C 100 kHz LEAKAGE AT + 25 C 100 kHz Irms AT + 25 C (%) () (A) (A) 2.5 WVDC AT + 85 C, SURGE = 3.3 V. . . 1.6 WVDC AT + 125 C, SURGE = 2.1 V 298D476X02R5M2T 2.4 20 4.0 0.08 298D227X02R5P2T 11.0 30 3.0 0.122 4 WVDC AT + 85 C, SURGE = 5.2 V. . . 2.7 WVDC AT + 125 C, SURGE = 3.4 V 298D475X0004K2T 0.5 15 20 0.027 298D106X0004K2T 4.0 50 20 0.027 298D106X0004M2T 0.5 8.0 5.0 0.071 298D156X0004K2T (2) 10 50 20 0.027 298D226X0004M2T 0.9 15 4.0 0.08 298D336X0004M2T 2.6 15 4.0 0.08 298D476X0004M2T 3.8 20 4.0 0.08 298D107X0004P2T 4.0 20 2.0 0.1 298D227X0004P2T 17.6 30 3.0 0.122 6.3 WVDC AT + 85 C, SURGE = 8 V. . . 4 WVDC AT + 125 C, SURGE = 5 V 298D105X06R3K2T 0.5 6.0 20 0.027 298D225X06R3K2T 0.5 8.0 20 0.027 298D225X06R3M2T 0.5 10 5.0 0.07 298D475X06R3K2T (2) 4.0 50 20 0.027 298D475X06R3M2T 0.5 8.0 3.0 0.09 298D106X06R3K2T (2) 10 50 20 0.027 298D106X06R3M2T 0.6 8.0 5.0 0.071 298D156X06R3M2T 1.0 20 7.0 0.06 PART NUMBER For technical questions, contact: tantalum@vishay.com C/C (1) (%)
47 220 4.7 10 10 15 22 33 47 100 220 1.0 2.2 2.2 4.7 4.7 10 10 15
M P K K M K M M M P P K K M K M K M M
30 30 30 30 10 30 15 20 30 30 30 30 30 10 30 10 30 10 20 www.vishay.com 39
Document Number: 40065 Revision: 01-Sep-08
298D
Vishay Sprague
STANDARD RATINGS
CAPACITANCE (F) CASE CODE MAX. ESR MAX. RIPPLE MAX. DC MAX. DF AT + 25 C 100 kHz LEAKAGE AT + 25 C 100 kHz Irms AT + 25 C (%) () (A) (A) 6.3 WVDC AT + 85 C, SURGE = 8 V. . . 4 WVDC AT + 125 C, SURGE = 5 V 298D226X06R3M2T 2.8 20 5.5 0.067 298D336X06R3M2T 4.2 30 7.5 0.058 298D476X06R3P2T 3.0 22 3.0 0.122 298D107X06R3P2T 6.3 30 2.0 0.150 10 WVDC AT + 85 C, SURGE = 13 V. . . 7 WVDC AT + 125 C, SURGE = 8 V 298D105X0010K2T 0.5 6.0 20 0.027 298D225X0010K2T 0.5 8.0 15 0.027 298D225X0010M2T 0.5 10 10 0.05 298D475X0010M2T 0.5 6.0 5.0 0.071 298D106X0010M2T 1.0 20 7.5 0.058 298D156X0010M2T 1.5 20 7.5 0.058 298D226X0010M2T 22 30 8.0 0.06 298D336X0010P2T 3.3 10 2.0 0.150 298D476X0010P2T 4.7 22 3.0 0.122 16 WVDC AT + 85 C, SURGE = 20 V. . . 10 WVDC AT + 125 C, SURGE = 12 V 298D105X0016K2T 3.0 10 20 0.027 298D105X0016M2T 0.5 6.0 12.0 0.045 298D225X0016M2T 0.5 10 12.0 0.045 298D475X0016M2T 0.8 8.0 6.0 0.06 25 WVDC AT + 85 C, SURGE = 32 V. . . 17 WVDC AT + 125 C, SURGE = 20 V 298D105X0025M2T 0.5 6.0 10.0 0.05 298D475X0025P2T 1.2 6.0 4.0 0.106 PART NUMBER
(2)
Solid Tantalum Chip Capacitors MICROTANTM Leadframeless Molded
C/C (1) (%)
22 33 47 100 1.0 2.2 2.2 4.7 10 15 22 33 47 1.0 1.0 2.2 4.7 1.0 4.7
M M P P K K M M M M M P P K M M M M P
15 30 20 20 30 30 10 15 15 20 30 10 20 30 15 15 15 10 10
Notes: (1) See Performance Characteristics tables, page 41
In development
CAPACITORS PERFORMANCE CHARACTERISTICS ELECTRICAL PERFORMANCE CHARACTERISTICS
PERFORMANCE CHARACTERISTICS - 55 C to + 85 C (to + 125 C with voltage derating) 20 %, 10 % (at 120 Hz) 2 Vrms at + 25 C using a capacitance bridge Limits per Standard Ratings Table. Tested via bridge method, at 25 C, 120 Hz. Limits per Standard Ratings Table. Tested via bridge method, at 25 C, 100 kHz. After application of rated voltage applied to capacitors for 5 minutes using a steady source of power with 1 k resistor in series with the capacitor under test, leakage current at 25 C is not more than Leakage Current described in. Standard Ratings Table. Note that the leakage current varies with temperature and applied voltage. See graph below for the appropriate adjustment factor. Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC rating at + 25 C Reverse Voltage 5 % of the DC rating at + 85 C Vishay does not recommended intentional or repetitive application of reverse voltage If capacitors are to be used at temperatures above + 25 C, the permissible rms ripple current or voltage shall be calculated using the derating factors: Temperature Derating 1.0 at + 25 C 0.9 at + 85 C 0.4 at + 125 C K-case: 0.015 Maximum Permissible Power M-case: 0.025 Dissipation at 25 C (W) in free air P-case: 0.045 + 85 C RATING + 125 C RATING WORKING VOLTAGE (V) SURGE VOLTAGE (V) WORKING VOLTAGE (V) SURGE VOLTAGE (V) 4 5.2 2.7 3.4 6.3 8 4 5 10 13 7 8 Operating Temperature 16 20 10 12 20 26 13 16 25 32 17 20 35 46 23 28 50 65 33 40 www.vishay.com 40 For technical questions, contact: tantalum@vishay.com Document Number: 40065 Revision: 01-Sep-08 ITEM Category Temperature Range Capacitance Tolerance Dissipation Factor (at 120 Hz) ESR (100 kHz)
298D
Solid Tantalum Chip Capacitors MICROTANTM Leadframeless Molded
TYPICAL LEAKAGE CURRENT FACTOR RANGE
100
Vishay Sprague
LEAKAGE CURRENT FACTOR
+ 125 C 10 + 85 C + 55 C 1.0 + 25 C 0 C 0.1 - 55 C 0.01
0.001 0 10 20 30 40 50 60 70 80 90 100
PERCENT OF RATED VOLTAGE
Notes * At + 25 C, the leakage current shall not exceed the value listed in the Standard Ratings Table * At + 85 C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings Table * At + 125 C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings Table
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM Life Test at + 85 C CONDITION 1000 h application of rated voltage at 85 C with a 3 series resistance, MIL-STD 202G Method 108A At 40 C/90 % RH 500 h, no voltage applied. MIL-STD 202G Method 103B At - 55 C/+ 125 C, 30 min each, for 5 cycles. MIL-STD 202G Method 107G POST TEST PERFORMANCE Capacitance Change Dissipation Factor Leakage Current Capacitance Change Dissipation Factor Leakage Current Capacitance Change Dissipation Factor Leakage Current Refer to Standard Ratings Table Not to exceed 150 % of initial Not to exceed 200 % of initial Refer to Standard Ratings Table Not to exceed 150 % of initial Not to exceed 200 % of initial Refer to Standard Ratings Table Not to exceed 150 % of initial Not to exceed 200 % of initial
Humidity Tests
Thermal Shock
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION CONDITION POST TEST PERFORMANCE Capacitance Change Dissipation Factor Leakage Current Refer to Standard Ratings Table Initial specified value or less Initial specified value or less
Terminal Strength
Apply a pressure load of 5 N for 10 1 s horizontally to the center of capacitor side body. AECQ-200 rev. C Method 006
There shall be no mechanical or visual damage to capacitors post-conditioning. Capacitance Change Dissipation Factor Leakage Current Capacitance Change Dissipation Factor Leakage Current Refer to Standard Ratings Table Initial specified value or less Initial specified value or less Refer to Standard Ratings Table Initial specified value or less Initial specified value or less
Substrate Bending (Board flex)
With parts soldered onto substrate test board, apply force to the test board for a deflection of 1 mm. AECQ-200 rev. C Method 005
Vibration
MIL-STD-202G, Method 204D, 10 Hz to 2000 Hz, 20G peak
There shall be no mechanical or visual damage to capacitors post-conditioning. Capacitance Change Dissipation Factor Leakage Current Refer to Standard Ratings Table Initial specified value or less Initial specified value or less
Shock
Mil-Std-202G, Method 213B, Condition I, 100G peak
There shall be no mechanical or visual damage to capacitors post-conditioning.
www.vishay.com 41
For technical questions, contact: tantalum@vishay.com
Document Number: 40065 Revision: 01-Sep-08
298D
Vishay Sprague
Solid Tantalum Chip Capacitors MICROTANTM Leadframeless Molded
MECHANICAL PERFORMANCE CHARACTERISTICS
Resistance to Solder Heat At 260 C, for 10 s, reflow Capacitance Change Dissipation Factor Leakage Current Refer to Standard Ratings Table Not to exceed 150 % of initial Not to exceed 200 % of initial
There shall be no mechanical or visual damage to capacitors post-conditioning. Solderability MIL-STD-202G, Method 208H, ANSI/J-Std-002, Test B. Applies only to solder and tin plated terminations. Does not apply to gold terminations. MIL-STD-202, Method 215D Encapsulation materials meet UL94 VO with an oxygen index of 32 %. There shall be no mechanical or visual damage to capacitors post-conditioning. There shall be no mechanical or visual damage to capacitors post-conditioning.
Resistance to Solvents Flammability
TYPICAL CURVES AT + 25 C, IMPEDANCE AND ESR VS. FREQUENCY
"M" Case 100 IMPEDANCE ESR 10 ESR/Z, 10 ESR/Z, 100 IMPEDANCE ESR "M" Case
1
47 F - 4 V
22 F - 4 V 1 0.1 0.1 0.1
1
10 FREQUENCY, kHz
100
1000
1
10 FREQUENCY, kHz
100
1000
1000
"M" Case IMPEDANCE ESR
"M" Case 1000 IMPEDANCE ESR 100
100 ESR/Z, ESR/Z, 10 4.7 F - 10 V 1 10 F - 6 V 1 0.1 0.1 0.1
10
1
10 FREQUENCY, kHz
100
1000
1
10 FREQUENCY, kHz
100
1000
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For technical questions, contact: tantalum@vishay.com
Document Number: 40065 Revision: 01-Sep-08
298D
Solid Tantalum Chip Capacitors MICROTANTM Leadframeless Molded
TYPICAL CURVES AT + 25 C, IMPEDANCE AND ESR VS. FREQUENCY
"M" Case 1000 IMPEDANCE ESR 100 ESR/Z, ESR/Z, 100 1 F - 16 V "M" Case 10 000 IMPEDANCE ESR 1000
Vishay Sprague
10 10 F - 10 V
10
1 0.1
1
10 FREQUENCY, kHz "P" CASE
100
1000
1 0.1
1
10 FREQUENCY, kHz
"P" CASE
100
1000
100.0 IMPEDANCE ESR
1000.0 IMPEDANCE ESR 100.0
10.0 ESR/Z,
ESR, Z 10.0
1.0
1.0
33 F - 10 V 0.1 0.1 1 10 100 1000 FREQUENCY, kHz
"P" CASE 100.0 IMPEDANCE ESR 0.1 0.1 1 10 FREQUENCY, kHz
4.7 F - 25 V 100 1000
"P" CASE 10.0 IMPEDANCE ESR
ESR, Z
ESR, Z 47 F - 10 V
10.0
1.0
1.0
220 F - 4 V 0.1 0.1 1 10 FREQUENCY, kHz 100 1000
0.1 0.1 1 10 FREQUENCY, kHz 100 1000
Document Number: 40065 Revision: 01-Sep-08
For technical questions, contact: tantalum@vishay.com
www.vishay.com 43
298D
Vishay Sprague
Solid Tantalum Chip Capacitors MICROTANTM Leadframeless Molded
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
0.157 0.004 [4.0 0.10] Deformation Between Embossments 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] 10 Pitches Cumulative Toler ance on T ape 0.008 [0.200] Embossment 0.069 0.004 0.079 0.002 [1.75 0.10] [2.0 0.05]
Tape Thickness 0.014 [0.35] MAX.
Top Cover Tape B1 MAX. (Note 6) K0 Top Cover Tape 0.004 [0.1] MAX. For Tape Feeder Reference only including draft. Concentric around B0 (Note 5) Center Lines of Ca vity
A0 B0
0.030 [0.75] MIN.(Note 3) 0.030 [0.75] MIN.(Note 4)
20 F W Maximum Component Rotation (Side or Front Sectional Vie w )
P1 D1 MIN. For Components 0.079 x 0.047 [2.0 x 1.2] and Larger . (Note 5)
USER DIRECTION OF FEED
Maximum Cavity Siz e (Note 1)
Cathode (-)
Anode (+) Direction of Feet
20 Maximum Component Rotation Typical Component Cavity Center Line
3.937 [100.0] 0.039 [1.0] MAX. Tape 0.039 [1.0] MAX. 0.9843 [250.0] Camber (Top View) Allo wable Camber to be 0.039/3.937 [1/100] Non-Cumulative Ov er 9.843 [250.0]
B0
Tape and Reel Specifications: All case sizes are available on plastic embossed tape per EIA-481-1. Tape reeling per IEC 286-3 is also available. Standard reel diameter is 7" [178 mm], 13" [330 mm] reels are available and recommended as the most cost effective packaging method. The most efficient packaging quantities are full reel increments on a given reel diameter. The quantities shown allow for the sealed empty pockets required to be in conformance with EIA-481-1. Reel size and packaging orientation must be specified in the Vishay Sprague part number.
A0 (Top View)
Typical Component Center Line
Note: Metric dimensions will govern. Dimensions in inches are rounded and for reference only.
CASE CODE 298D P
TAPE SIZE
B1 (MAX.)
D1 (MIN.)
F
K0 (MAX.)
P1
W
8 mm
0.108 [2.75]
0.039 [1.0]
0.138 0.002 [3.5 0.05]
0.054 [1.37]
0.157 0.004 [4.0 1.0]
0.315 0.0118/- 0.0039 [8.0 0.30/- 0.10]
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For technical questions, contact: tantalum@vishay.com
Document Number: 40065 Revision: 01-Sep-08
298D
Solid Tantalum Chip Capacitors MICROTANTM Leadframeless Molded
PAPER TAPE AND REEL PACKAGING IN INCHES [millimeters]
T P2
Vishay Sprague
O Do
Po
[10 pitches cumulative tolerance on tape 0.2 mm] E1
Ao
F Bo W E2
Bottom Cover Tape
Top Cover Tape Cavity Center Lines P1 Anode Cavity Size Note 1 G
Bottom Cover Tape
User Feed Direction
Figure 2
298D CASE TAPE SIZE SIZE K M 8 mm 8 mm A0 B0 D0 P0 P1 P2 E F W T
0.033 0.002 0.053 0.002 0.06 0.004 0.157 0.004 0.078 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.03 0.002 [0.85 0.05] [1.35 0.05] [1.5 0.1] [4.0 0.1] [2.0 0.1] [2.0 0.05] [1.75 0.1] [3.5 0.05] [8.0 0.2] [0.75 0.05] 0.041 0.002 0.071 0.002 0.06 0.004 0.157 0.004 0.157 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.037 0.002 [1.05 0.05] [1.8 0.05] [1.5 0.1] [4.0 0.1] [4.0 0.1] [2.0 0.05] [1.75 0.1] [3.5 0.05] [8.0 0.2] [0.95 0.05]
STANDARD PACKAGING QUANTITY
SERIES CASE CODE K 298D M P QTY (PCS/REEL) 7" REEL 10 000 4000 3000 13" REEL N/a N/a N/a
RECOMMENDED VOLTAGE DERATING GUIDELINES
STANDARD CONDITIONS: FOR EXAMPLE: OUTPUT FILTERS Capacitor Voltage Rating 4.0 6.3 10 16 20 25 35 50 SEVERE CONDITIONS: FOR EXAMPLE: INPUT FILTERS Capacitor Voltage Rating 4.0 6.3 10 16 20 25 35 50 Document Number: 40065 Revision: 01-Sep-08 Operating Voltage 2.5 3.6 6.0 10 12 15 24 28 Operating Voltage 2.5 3.3 5.0 8.0 10 12 15 24 www.vishay.com 45
For technical questions, contact: tantalum@vishay.com
298D
Vishay Sprague
Solid Tantalum Chip Capacitors MICROTANTM Leadframeless Molded
POWER DISSIPATION
CASE CODE K 298D M P MAXIMUM PERMISSIBLE POWER DISSIPATION AT + 25 C (W) IN FREE AIR 0.015 0.025 0.045
RECOMMENDED REFLOW PROFILES
Tp C TL C Temperature (C) Ts MAX. C
(tp)
(tL)
Ts MAX. C
Preheat (ts)
25 C All Case Codes
TYPE 298D
TP TP lead (Pb)-free Sn/Pb 260 C
tP
TL TL TS MIN. TS MIN. TS MAX. TS MAX. tS tS lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb 217 C 183 C 150 C 100 C 200 C 150 C 60 - 150
tL
225 C 10
60 - 90 60
PAD DIMENSIONS in inches [millimeters]
B D C
A
CASE CODE 298D K
A (MIN.)
B (NOM.)
C (NOM.)
D (NOM.)
0.028 [0.70]
0.018 [0.45]
0.024 [0.60]
0.059 [1.50]
M
0.039 [1.00]
0.028 [0.70]
0.24 [0.60]
0.080 [2.00]
P
0.063 [1.60]
0.031 [0.80]
0.047 [1.20]
0.110 [2.80]
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For technical questions, contact: tantalum@vishay.com
Document Number: 40065 Revision: 01-Sep-08
298D
Solid Tantalum Chip Capacitors MICROTANTM Leadframeless Molded
GUIDE TO APPLICATION
1. A-C Ripple Current: The maximum allowable ripple current shall be determined from the formula: I rms = where, P= P --------------R ESR 7. 7.1 6.
Vishay Sprague
Printed Circuit Board Materials: Molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). Attachment: Solder Paste: The recommended thickness of the solder paste after application is 0.007" 0.001" [0.178 mm 0.025 mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. Soldering: Capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. The Soldering Profile charts show recommended time/temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 C per second. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor.
RESR = 2.
Power dissipation in watts at + 25 C as given in the table in paragraph number 5 (power dissipation). The capacitor equivalent series resistance at the specified frequency.
A-C Ripple Voltage: The maximum allowable ripple voltage shall be determined from the formula: P V rms = Z --------------R ESR or, from the formula: V rms = I rms x Z where, P= Power dissipation in watts at + 25 C as given in the table in paragraph number 5 (power dissipation). The capacitor equivalent series resistance at the specified frequency. The capacitor impedance at the specified frequency. 7.2
RESR = Z= 2.1
The sum of the peak AC voltage plus the applied DC voltage shall not exceed the DC voltage rating of the capacitor. The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10 % of the DC working voltage at + 25 C. Reverse Voltage: These capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the DC rating at + 25 C, 5 % of the DC rating at + 85 C and 1 % of the DC rating at + 125 C. Temperature Derating: If these capacitors are to be operated at temperatures above + 25 C, the permissible rms ripple current or voltage shall be calculated using the derating factors as shown:
TEMPERATURE + 25 C + 85 C + 125 C DERATING FACTOR 1.0 0.9 0.4
7.2.1 Backward and Forward Compatibility: Capacitors with SnPb or 100 % tin termination finishes can be soldered using SnPb or lead (Pb)-free soldering processes. 8. Cleaning (Flux Removal) After Soldering: Molded capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC/ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/l at 40 kHz for 2 minutes. Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design.
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2.2
3.
8.1
4.
9.
5.
Power Dissipation: Power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent Irms value be established when calculating permissible operating levels. (Power Dissipation calculated using + 25 C temperature rise.)
Document Number: 40065 Revision: 01-Sep-08
For technical questions, contact: tantalum@vishay.com
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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